基于大数据的公交专用道周边用地属性和效益表现分析

为更好推动公共交通优先发展,打造上海"后公交都市"时代,提升公交专用道运营效率,以上海市已建公交专用道为研究对象,基于手机数据、POI数据、公交IC卡数据、公交GPS数据、网约车GPS数据、公交企业运营数据,对公交专用道两侧500?m范围内的居住、就业、购物休闲和医疗服务共4项用地属性进行了分析.在此基础上,以4项用地属性作为聚类因素,将全市公交专用道进行聚类,分析各类公交专用道的效益表现及其与用地属性的相关性.该项研究填补了利用大数据进行公交专用道周边用地属性分析的空白,将加深行业管理部门、公交企业等对公交专用道的认识,有助于精细化管理公交专用道和优化线路服务.     

Hardware architecture design of block-matching and 3D-filtering denoising algorithm

Block-matching and 3D-filtering(BM3D) is a state of the art denoising algorithm for image/video,which takes full advantages of the spatial correlation and the temporal correlation of the video. The algorithm performance comes at the price of more similar blocks finding and filtering which bring high computation and memory access. Area, memory bandwidth and computation are the major bottlenecks to design a feasible architecture because of large frame size and search range. In this paper, we introduce a novel structure to increase data reuse rate and reduce the internal static-random-access-memory(SRAM) memory. Our target is to design a phase alternating line(PAL) or real-time processing chip of BM3 D. We propose an application specific integrated circuit(ASIC) architecture of BM3 D for a 720 × 576 BT656 PAL format. The feature of the chip is with 100 MHz system frequency and a 166-MHz 32-bit double data rate(DDR). When noise is σ = 25, we successfully realize real-time denoising and achieve about 10 d B peak signal to noise ratio(PSNR) advance just by one iteration of the BM3 D algorithm.     

Surface spline interpolation method for thermal reconstruction with limited sensor data of non-uniform placements

With the characteristic size reducing as well as the power densities exponentially increasing, elevated chip temperatures are true limiters to the performance and reliability of integrated circuits. To address these thermal issues, it is essential to use a set of on-chip thermal sensors to monitor temperatures during operation. These temperature sampling results are then used by thermal management techniques to appropriately manage chip performance. In this paper, we propose a surface spline interpolation method to reconstruct the full thermal characterization of integrated circuits with non-uniform thermal sensor placements. We construct the thermal surface function using the mathematical tool of surface spline with the matrix calculation of the non-uniform sample data. Then, we take the coordinates of the points at grid locations into the surface function to get its temperature value so that we can reconstruct the full thermal signals. To evaluate the effectiveness of our method, we develop an experiment for reconstructing full thermal status of a 16-core processor. Experimental results show that our method outperforms the inverse distance weighting method based on dynamic Voronoi diagram and spectral analysis techniques both in the average absolute error metric and the hot spot absolute error metric with short enough runtime to meet the real-time process demand. Besides, our method still has the advantages such as its mathematical simplicity with no need of prehprocess.