A Machine Vision System for Ball Grid Array Package Inspection |
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| Authors: | XIA Nian-jiong CAO Qi-xin LEE Jey |
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| Affiliation: | 1. Research Inst. of Robotics, Shanghai Jiaotong Univ. , Shanghai 200030, China
2. Center for Intelligent Maintenance, Univ. of Wisconsin at Milwaukee, Milwaukee, WI 53211 USA |
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| Abstract: | An optical inspection method of the Ball Grid Array package(BGA) was proposed by using a machine vision system. The developed machine vision system could get main critical factors for BGA quality evaluation, such as the height of solder ball, diameter, pitch and coplanarity. The experiment has proved that this system is available for BGA failure detection. |
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| Keywords: | ball gird array machine vision system coplanarity image processing |
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