| 焊层空洞对IGBT 模块热应力的影响简 |
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| 引用本文： | 吴煜东,常桂钦,彭勇殿,方杰,唐龙谷,李继鲁.焊层空洞对IGBT 模块热应力的影响简[J].变流技术与电力牵引,2014(1):17-23. |
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| 作者姓名： | 吴煜东 常桂钦 彭勇殿 方杰 唐龙谷 李继鲁 |
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| 作者单位： | 电力电子器件湖南省重点实验室;株洲南车时代电气股份有限公司; |
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| 摘 要： | 焊层空洞是造成IGBT模块散热不良和疲劳失效的主要原因之一。考虑芯片场环区的影响,建立了IGBT模块封装结构的三维有限元模型;研究了不同焊层厚度、焊层空洞率和空洞位置对模块最高结温与最大等效应力的影响;探讨了焊层空洞对模块瞬态热阻抗的影响。
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| 关 键 词： | IGBT模块 焊层厚度 空洞率 热分析 应力分析 瞬态热阻抗 |
Effect of Solder Voids on IGBT Thermal and Stress Performance |
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| WU Yu-dong,CHANG Gui-qin,PENG Yong-dian,FANG Jie,TANG Long-gu,LI Ji-lu.Effect of Solder Voids on IGBT Thermal and Stress Performance[J].Converter Technology & Electric Traction,2014(1):17-23. |
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| Authors: | WU Yu-dong CHANG Gui-qin PENG Yong-dian FANG Jie TANG Long-gu LI Ji-lu |
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| Institution: | 1. Hunan Provincial Key Laboratory of Power Electronics Devices, Zhuzhou, Hunan 412001, China; 2. Zhuzhou CSR Times Electric Co., Ltd., Zhuzhou, Hunan 412001, China) |
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| Abstract: | Solder void is one of the important reasons for the heat diffusion badness and fatigue failure of IGBT module. A 3-D finite model was established for IGBT package configuration with considering the influence of die＇s field ring area. It studied the effect of solder thickness, void percentage and void position on maximum temperature and equivalent stress, and analyzed the effect of void percentage on transient thermal impedance. |
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| Keywords: | IGBT module solder layer thickness void ratio thermal an~ysis stress analysis transient thermal impedance |
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