| 低温共烧陶瓷材料工艺研究 |
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| 引用本文： | 胡明星,徐迪静,缪文桦,陈立庄.低温共烧陶瓷材料工艺研究[J].交通科技与经济,2007,9(3):70-71,74. |
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| 作者姓名： | 胡明星 徐迪静 缪文桦 陈立庄 |
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| 作者单位： | 1. 黑龙江工程学院,材料系,黑龙江,哈尔滨,150050
2. 江苏科技大学,材料科学与工程学院,江苏,镇江,212003 |
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| 摘 要： | 低温共烧陶瓷(LTCC)技术目前正逐渐走向成熟,并成为电子封装领域研究的热点。它在高可靠性、高密度方面具有其它组装技术无可比拟的优势。LTCC技术的实现和进步很大程度上依赖于流延和低温共烧陶瓷这两个关键环节。从实现共烧陶瓷低温烧结的途径、陶瓷粉体合成以及流延工艺三个方面探讨了LTCC的技术进展情况。
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| 关 键 词： | 低温共烧陶瓷 封装 粉体合成 流延 |
| 文章编号： | 1008-5696（2007）03-0070-02 |
| 修稿时间： | 2007-12-30 |
Research on the low temperature co- fired ceramic material technique |
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| HU Ming-xing,XU Di-jing,MIAO Wen-hua,CHEN Li-zhuang.Research on the low temperature co- fired ceramic material technique[J].Technology & Economy in Areas of Communications,2007,9(3):70-71,74. |
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| Authors: | HU Ming-xing XU Di-jing MIAO Wen-hua CHEN Li-zhuang |
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| Institution: | 1. Dept. of Material and Chemistry Engineering , Heilongjiang Institute of Technology, Harbin 150050, China; 2. College of Ma terials Science and Engineering ,Jiangsu University of Science and Technology, Zhenjiang 212003, China |
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| Abstract: | With technology of low temperature co-fired ceramic going mature gradually,it evolves to investigative hot spot in the field of electronic packaging.The technology has unexampled predominance comparing with oth- er packaging technologies about aspect of high reliability and high density.Realization and progression of LTCC depends on two key joints of flow casting and low temperature co-fired ceramic in great degree.The paper summarizes the development of LTCC technique from three aspects,which are the implementation track of the co-fired ceramic low-temperature sintering,the synthesis of ceramic powder and the engineering of low casting. Also,the paper has viewed the future of it through the present researches. |
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| Keywords: | low temperature co-fired ceramic packaging powder synthesis flow casting engineering |
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