Micro-Grinding Performance of Hard-Brittle Chip Materials in Precision Micro-Grinding Microgroove

The micro-structure on hard-brittle chip materials (HBCMs) surface can produce predominant functions and features. The micro-grinding with diamond wheel micro-tip is an efficient method to machine microstructure on HBCMs. However, different HBCMs and crystal orientation may have a significant influence on the micro-grinding performance. In this paper, the micro-grinding performance along different crystal orientation of HBCMs is investigated. First, a dressed 600^# diamond grinding wheel is used to micro-grind micro-structure on HBCMs. Then, the experiment of micro-grinding force test is completed. Finally, the quality of microgroove, the grinding ratio and the micro-grinding force are investigated and they are related to the crystal orientation of HBCMs. It is shown that the stronger resistance to the micro-crack propagation has the best quality of microgroove and the smallest grinding ratio. Moreover, the hardest single-crystal SiC has the best machinability and the micro-grinding force is 38.9%, 10.8% and 46.8% less than the one of sapphire, single-crystal Si and quartz glass, respectively. The direction to micro-grind easily is the crystal orientation 〈10(overline 1 )0〉 for single-crystal SiC and sapphire. In addition, the micro-grinding force increases with the increase of the micro-grinding depth and feed rate and decreases with the increase of the grinding wheel speed.