| 高导热绝缘复合材料的研究 |
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| 引用本文： | 张志龙,吴昊,景录如.高导热绝缘复合材料的研究[J].舰船电子工程,2005,25(6):36-40. |
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| 作者姓名： | 张志龙 吴昊 景录如 |
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| 作者单位： | 1. 中国地质大学材料科学与化学工程学院,武汉,430074
2. 华东交通大学信息工程学院,南昌,330013 |
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| 摘 要： | 综述了高导热绝缘复合材料的导热机理和常用的导热理论模型，介绍了基体材料和填料的研究进展，复合技术的进展及其在电子、电机行业的应用前景。
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| 关 键 词： | 高导热 绝缘 复合材料 应用 |
| 收稿时间： | 2005-03-21 |
| 修稿时间： | 2005-04-13 |
Study of the High Thermal Conductivity and Electrical Insulation Composite |
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| Zhang Zhilong,Wu Hao,Jing Luru.Study of the High Thermal Conductivity and Electrical Insulation Composite[J].Ship Electronic Engineering,2005,25(6):36-40. |
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| Authors: | Zhang Zhilong Wu Hao Jing Luru |
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| Institution: | 1.College of Material Science and Chemical Engineering, CUG ,Wuhan 430074;2.School of Information Engineering, East China Jiaotong University, Nanchang 330013 |
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| Abstract: | The heal conduction mechanism and normally used theoretical models of high thermal conducting and electrical insulating composite are summnarized in the paper. The progress in the polymer material, filler and the fabricated techniques is introduced, otherwise, the prospect of such materials applied in electronic field and electromotor is presented and predicted |
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| Keywords: | high thermal conductivity electrical insulation composite application |
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