HFSS和CST应用于过孔模型的协同仿真研究

基于过孔的实际参数，利用HFSS和CST建立了六层高速PCB板过孔的全波分析理论模型。在1-10GHz频段，研究过孔的四个重要参数，包括孔径及内外径的差值比、过孔长度、基板介电常数等，对信号传输性能的影响；并选择射频常用频点，f=5GHz进行了仿真验证，得到了优化信号完整性的设计参数：内径不大于10rail，外径不大于25mil，过孔长度小于55rail，内外径差值越大越好，比值优化为l：2．3。仿真结果表明：理论模型是实际有效的，并且优化的设计参数可以保证过孔的阻抗连续性和较小的反射损耗、插入损耗。这对高频PCB板的设计有很好的指导意义。

Research on the Co-simulation of Via Model Using HFSS and CST

Co-simulation of the theoretical via model is presented by using HFSS and CST,with the sweep frequency ranges 1~10 GHz.The impact of structure parameters on signal integrity is analysised,including the via diameter,the ratio of inner and outer diameter,the via length and the relative permittivity of substrate.We select f=5 GHz as the RF validation frequency.The simulation results show that inner radius using no more than 10 mil,outer radius using no more than 25 mil and through-hole length using less than 55 mil can guarantee the continuity of impedance and cost lower insertion loss.The optimal ratio between inner diameter and outer diameter is 1 to 2.3.Above all,the model is practical and effective.It’s a good guidance for the design of high-frequency Printed Circuit Board.