| 焊料层空洞对IGBT芯片温度分布影响分析 |
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| 引用本文： | 夏燕飞,罗毅飞,汪波,刘宾礼.焊料层空洞对IGBT芯片温度分布影响分析[J].船电技术,2015(12):1-5. |
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| 作者姓名： | 夏燕飞 罗毅飞 汪波 刘宾礼 |
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| 作者单位： | 海军工程大学 舰船综合电力技术国防科技重点实验室,武汉,430033 |
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| 基金项目： | 国家重点基础研究发展计划(973计划)，国家自然科学基金重大项目 |
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| 摘 要： | 基于IGBT七层结构,建立三维有限元模型,模拟研究焊料层空洞对芯片温度场的影响,讨论空洞对芯片结温作用机理。研究表明:焊料层空洞改变芯片散热途径,影响芯片温度分布;单个空洞越大,芯片结温越高,在中心和外边缘位置结温升高更加显著;对于多个空洞,分布越密集,结温越高。
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| 关 键 词： | 有限元模型 焊料层空洞 温度分布 |
The Effect of Voiding in the Solder Die on the Temperature Distribution of IGBT Chips |
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| Abstract: | Based on the IGBT seven-layer structure, a three dimensional finite element model is established to simulate the effect of voiding in the solder die on the temperature field of the chip, and the mechanism of the effect of voiding on the chip junction temperature is discussed. The results show that: voiding in the solder die change the cooling path and the temperature distribution of the chip, the larger the single hole, the higher the chip junction temperature, and the temperature rise is more significant in the center and outer edge location than other position in the chip, for multiple holes, the more concentrated the distribution, the higher the junction temperature. |
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| Keywords: | finite element model solder die voiding temperature distribution |
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