Morphological evolution of a void under thermal and mechanical loads |
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| Authors: | Er-li Li Xi Chen Hua Wang Xi Wang Zhong-hua Li |
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| Institution: | (1) School of Naval Architecture, Ocean and Civil Engineering, Shanghai Jiaotong University, Shanghai, 200240, China |
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| Abstract: | A model for the morphological evolution of a void under thermal and mechanical loads is established, and the thermodynamics potential of the model is given based on energy principle. Thus, the path and the bifurcation condition of the morphological evolution of the void are described, which gives some insight into the reliability of the interconnect under combined thermal and mechanical loads. |
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| Keywords: | thermal and mechanical loads morphological evolution of void thermodynamics potential |
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