功率循环测试中衬底焊接层的可靠性

基板与陶瓷衬底之间的焊层寿命通常利用IGBT模块的被动加热和冷却(热循环)来测试,但这种试验会引起焊层失效(分层)。实际应用中,IGBT和二极管芯片是主动被加热的,诸如焊线脱落等其它模式的失效也会限制使用寿命,通常可通过功率循环试验来评估这种应力的影响。本文通过功率循环试验来评估衬底焊层的失效,利用高循环周次的测试进行有效的衬底焊层热循环试验,其关键在于功率循环过程中焊层温度的预测。在温度波动不大的条件下,比较了被动热循环和主动功率循环时对焊接寿命的影响。

Reliability of Substrate Solder Joints from Power Cycling Tests

The lifetime of the solder joint between base plate and ceramic substrate is usually tested by passively heating and cooling the IGBT module(thermal cycling).This provokes failures(delamination) in that solder layer.However,the IGBT and diode dies are actively heated in the application.Other failure modes(e.g.bonding wires lift off) are addressed and limit the lifetime.This kind of stress is usually tested via power cycling.In the present paper the power cycling test results are evaluated with respect to fa...