PC/ABS基材产品漏镀不良的分析和解决

采用红外谱图分析及扫描电镜分析等方法,分析了PC/ABS基材电镀产品表面漏镀形成的原因,并通过反复验证找出了合理的解决方案。结果显示,发生漏镀的位置PC含量较高,橡胶B(丁二烯)含量较低,造成表面粗化不良,通过优化粗化浓度能有效减少漏镀不良的产生。

Analysis and Solution of the Surface Leakage Plating on PC/ABS Substrate

By means of infrared spectrum analysis and scanning electron microscope analysis,the causes of the surface leakage of PC/ABS substrate electroplating products were analyzed,and a reasonable solution was found through repeated verification.The results showed that the content of PC was higher and the content of rubber B(butadiene)was lower at the location of plating leakage,resulting in abnormal etching.By optimizing the etching concentration,it can effectively reduce the occurrence of the surface leakage plating.