湿热导致电子元件封装脱层断裂的分析

采用高聚物基复合物作为封装材料的微电子元件易受到湿气的侵入，在焊接过程中，由于温度和湿气的影响，引发电子元件的脱层断裂。对于湿热敏感的高分子材料，当考虑其由湿热的弹性断裂问题时，裂尖和能量释放率可以表示为一个积分表达式。运用有限元法，利用能量释放率的表达式，对不同的裂纹尺寸和封装材料厚度，计算了在不同焊接温度下能量释放率的曲线。对比能量释放率的试验数据，对电子元件的断裂进行了预测。

The Analysis of Delamination and Fracture in IC Packages

Micro electronic components encapsulated with the high polymer matrix composites are easy to be affected with damp. In the process of welding, the temperature and moisture often cause delamination and fracture in electronic components. For moisture and heat sensitive high polymer materials, when considering the problem of elastic breakdown induced by moisture and heat, the strain energy release rate at the crack tip can be expressed as an integral form. With FEM and by using the expression of energy release rate, the curves for the relationship of energy release rate versus the ratios of crack length to the thickness of the package are obtained at different welding temperature. The fracture of the electronic components is predicted through Comparing the experimental data of strain energy release rate.