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SMT表面贴装技术工艺应用与探讨
引用本文:谢青松,赵立博.SMT表面贴装技术工艺应用与探讨[J].船电技术,2009,29(10):36-38.
作者姓名:谢青松  赵立博
作者单位:中国船舶重工集团公司七一二研究所,武汉,430064
摘    要:随着微电子和计算机等技术的发展,贴片元器件被广泛使用,这对电子组装工艺提出了新的要求。表面贴装技术SMT(Surface Mounted Technology)作为新一代的电子装联技术,已经运用于包括军品行业的各个行业,本文从实际出发,对表面贴装工艺流程中几个关键的工艺过程进行了分析和探讨。

关 键 词:SMT  丝印  表面贴装  回流焊

Application and Discussion on SMT Technics
Xie Qingsong,Zhao Libo.Application and Discussion on SMT Technics[J].Marine Electric & Electronic Technology,2009,29(10):36-38.
Authors:Xie Qingsong  Zhao Libo
Institution:(Wuhan Institute of Marine Electric Propulsion, C SIC, Wuhan 430064, China)
Abstract:With the development of the computer and microelectronics technology, the placement parts are used widely, there is a new request to the electronics construction technique. As the new generation electronic mounted technology, SMT (Surface Mounted Technology)has already been used in much industry include the war industry. This paper sets out from reality and analyzes a few key technics processes in the SMT technics process.
Keywords:SMT
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