| 系统芯片的软硬件协同设计技术 |
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| 引用本文： | 程照明,蔡德钧.系统芯片的软硬件协同设计技术[J].舰船电子工程,2004,24(3):11-15. |
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| 作者姓名： | 程照明 蔡德钧 |
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| 作者单位： | 华中科技大学,武汉,430074 |
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| 摘 要： | IC设计已经进入SoC时代。传统的设计手段已经无法满足需要，软件和硬件的结合越来越紧密。介绍了软硬件协同设计技术的基本概念和设计流程，对该技术进行了评价和展望。
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| 关 键 词： | SoC 软硬件协同设计 IP |
| 修稿时间： | 2003年8月13日 |
Hardware/Software Co-design Technology of SoC |
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| Cheng Zhaomin,Cai Dejun.Hardware/Software Co-design Technology of SoC[J].Ship Electronic Engineering,2004,24(3):11-15. |
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| Authors: | Cheng Zhaomin Cai Dejun |
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| Abstract: | IC design technology has entered SoC era. Traditional design methods have not done well in it completely. The relationship of hardware and software is more and more close. The basic concepts and design flow of hardware/software co-design have been introduced in this paper. The estimation and prospect of this technology has been also provided. |
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| Keywords: | SoC hardware/software co-design IP |
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