微波信号LTCC多层互连设计

不同平面的微波信号低插损互连过渡已成为决定三维T/R组件性能优劣的关键问题之一,论文针对此问题介绍了一种窄带微波信号多层互连设计.该设计使用通孔垂直互连和带状线-微带线过渡,将电磁波从顶层微带线传输到底层微带线,从而完成异面微波信号互连.该设计运用三维高频电磁仿真软件HFSS建立并对比分析了三种模型,最后综合工艺难度和仿真结果挑选出最优方案加工成实物.经测试得到：在12GHz～18GHz范围内,插损小于0.9dB,回波损耗大于12dB,与仿真结果基本一致.实验结果表明,该结构具有尺寸小、插损低、应用范围广等特点.

Microwave Signal LTCC Multilayer Interconnection Design

The paper introduces a narrow band multilayer interconnection design of microwave signal since low inser tion loss of the microwave interconnection transition structure on different surface one of the significant point deciding the ca pability of the 3D T/R model. The structure has accomplished the interconnection of microwave signals on different plane transmitting electromagnetic wave from top microstrip to the bottom microstrip by the via hole of vertical interconnect and striplinetomicrostrip transition. The three kind model are analyzed and optimized by HFSS software. The optinal scheme is chosen and manufactred into product by considening the manufacturing difficulty and simulation result. The measured results show that the insertion loss is less than 0. 9dB, the return loss is better than 12dB in 12GHz to 18GH2, which are ultimately accountable to the optimistic results. The experiment results indicate that the structure has the advantages such as small size, low insertion loss, broad application.