| QFP结构在温度循环下的有限元分析 |
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| 引用本文： | 洪家娣,张元才. QFP结构在温度循环下的有限元分析[J]. 华东交通大学学报, 2008, 25(1): 136-140 |
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| 作者姓名： | 洪家娣 张元才 |
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| 作者单位： | 华东交通大学,机电工程学院,江西,南昌,330013;华东交通大学,职业技术学院,江西,南昌,330013 |
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| 摘 要： | 如果QFP电子封装器件发生较大塑性变形，将影响其正常使用．利用有限元分析技术来讨论温度循环载荷作用下影响QFP焊点塑性变形的因素，为控制其变形幅度提供依据．
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| 关 键 词： | 方形扁平封装器件 电子封状 有限元法 温度循环 塑性应变 |
| 文章编号： | 1005-0523(2008)01-0136-05 |
| 修稿时间： | 2007-10-23 |
Finite Element Analysis of QFP Structure Subjected to Circular Heat |
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| HONG Jia-di,ZHANG Yuan-cai. Finite Element Analysis of QFP Structure Subjected to Circular Heat[J]. Journal of East China Jiaotong University, 2008, 25(1): 136-140 |
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| Authors: | HONG Jia-di ZHANG Yuan-cai |
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| Affiliation: | HONG Jia-di, ZHANG Yuan-cai( 1. School of Mechanical and Electrical Engineering; 2. School of Vocational Education and Technology, East China Jiaotong University Nanchang 330013, China) |
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| Abstract: | Circular heat loadings lead to plastic deformation of QFP package structures.To increase the reliability of QFP package structures,some measures should be sought.In this paper,FEM technique is used to investigate the influence of FR-4 plate thickness,solders,strain rate sensitivity of stress and variation range of temperature.According to the numerical results,some advice is given to reduce the plastic deformation of QFP solders subjected to circular heat. |
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| Keywords: | QFP package electron FEM circular heat plastic strain |
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