| 高压IGBT模块衬板焊接工艺研究 |
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| 引用本文： | 赵洪涛.高压IGBT模块衬板焊接工艺研究[J].变流技术与电力牵引,2011(2). |
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| 作者姓名： | 赵洪涛 |
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| 作者单位： | 株洲南车时代电气股份有限公司; |
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| 摘 要： | 分析真空回流焊接的物理过程及温度特性,并通过试验分析真空回流焊接工艺变量对IGBT封装衬板焊接质量的影响。
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| 关 键 词： | 回流焊接 真空 无铅焊膏 回流线形 |
Research on Substrate Soldering of High-voltage IGBT Modules |
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| ZHAO Hong-tao.Research on Substrate Soldering of High-voltage IGBT Modules[J].Converter Technology & Electric Traction,2011(2). |
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| Authors: | ZHAO Hong-tao |
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| Institution: | ZHAO Hong-tao(Zhuzhou CSR Times Electric Co.,Ltd.,Zhuzhou,Hunan 412001,China) |
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| Abstract: | It is analyzed physical process and temperature characteristics of vacuum reflow soldering,and also summarized the influence of variables for vacuum reflow soldering process on the quality of IGBT substrate soldering through experiments analysis. |
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| Keywords: | reflow soldering vacuum lead-free solder paste soldering recipes |
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