| 大功率IGBT模块封装中的超声引线键合技术 |
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| 引用本文： | 覃荣震,张泉.大功率IGBT模块封装中的超声引线键合技术[J].变流技术与电力牵引,2011(2). |
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| 作者姓名： | 覃荣震 张泉 |
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| 作者单位： | 株洲南车时代电气股份有限公司; |
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| 摘 要： | 从超声引线键合的机理入手,对大功率IGBT模块引线的材料和键合界面特性进行了分析,探讨了键合参数对键合强度的影响。最后介绍了几种用于检测键合点强度的方法,利用检测结果对键合参数进行进一步的调整,以实现引线键合工艺最佳化。
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| 关 键 词： | 引线键合 大功率IGBT 模块封装 |
Ultrasonic Wire Bonding Technology in High-power IGBT Module Assembly |
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| QIN Rong-zhen,ZHANG Quan.Ultrasonic Wire Bonding Technology in High-power IGBT Module Assembly[J].Converter Technology & Electric Traction,2011(2). |
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| Authors: | QIN Rong-zhen ZHANG Quan |
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| Institution: | QIN Rong-zhen,ZHANG Quan(Zhuzhou CSR Times Electric Co.,Ltd.,Zhuzhou,Hunan 412001,China) |
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| Abstract: | It introduces the mechanism of ultrasonic wire bonding,analyzes the material properties and the interface characteristics of the bonding for high-power IGBT module,and discusses the effects of bonding parameters on bonding strength.Several detection methods of bonding points?strength are recommended,the parameters are further adjusted through the test results,so that the optimal wire bonding process of high-power IGBT modules can be achieved. |
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| Keywords: | wire bonding high-power IGBT module assembly |
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