| 铜阳极对酸性镀铜的影响 |
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| 引用本文： | 杨锡玉. 铜阳极对酸性镀铜的影响[J]. 大连铁道学院学报, 1994, 15(2): 13-17 |
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| 作者姓名： | 杨锡玉 |
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| 摘 要： | 针对印刷线路板生产过程中，酸性镀铜时磷铜阳极的质量对线路板中孔质量的影响，采用金相显微、扫描电镜、能谱等现代分析手段，找出了影响磷铜阳极质量的主要因素．
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| 关 键 词： | 阳极铜 印刷电路板 酸度 镀铜 电镀 |
Effect of Copper Anodes on the Acid Copper Plating |
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| Yang Xiyue. Effect of Copper Anodes on the Acid Copper Plating[J]. Journal of Dalian Railway Institute, 1994, 15(2): 13-17 |
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| Authors: | Yang Xiyue |
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| Affiliation: | Dept.of Material Science and Engineering |
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| Abstract: | For the process producting the printed curcuit plates,discusses the effcet of the quality ofphosplor copper on that of middle-holes in the printed circuit plates during acid copper plating pro-cess,and finds the major factors which influences on the quality of phosphor copper,by using themodern analysis methods of the metallographic microstructure,scanning electron microscopes,energy spectrum. |
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| Keywords: | anode copper anode mud printed circuit plates acidity copper plating |
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