表面贴装技术中对印刷电路板的设计要求 |
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引用本文: | 蒋时雨.表面贴装技术中对印刷电路板的设计要求[J].交通部上海船舶运输科学研究所学报,1999,22(1):49-53. |
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作者姓名: | 蒋时雨 |
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摘 要: | 表面贴装技术是第四代电子装联技术。要保证表面贴装技术中的焊接质量,必须重视印刷电路板的设计。根据我所引进的表面贴装技术设备的生产现状,对表面贴装技术中的印刷电路板的设计提出一些要求。概略介绍对印刷电路板的基准标准点设置、定位孔与组合板设计、贴片元器件布置以及布线与焊盘设计的要求。
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关 键 词: | 电子装联技术 表面贴装 印刷电路板设计 |
Requirements for Printed Circult Board Design in Surface Mounting Technology |
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Authors: | Jian Shiyu |
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Institution: | Engineering Center |
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Abstract: | Surface mounting technology (SMT) is the fourth
generation of electronics assembly technique. To ensure the welding quality in surface
mounting technology more attentions must be paid to the design of printed circult board.
According to the present condition of the imported surface mounting technical equipments by
SSSRI some requirements for the design of printed circult board in SMT are put forward by the
paper. The requirements for the setting of the basic reference mark of printed circult board, the
design of location holes and combination boards, the arrangements of elementary surface
mounting devices, the design of wiring and welding tray are briefly introduced in the paper. |
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Keywords: | Electronics assembly technique surface mounting design of printed circult board |
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