首页 | 本学科首页   官方微博 | 高级检索  
     检索      

表面贴装技术中对印刷电路板的设计要求
引用本文:蒋时雨.表面贴装技术中对印刷电路板的设计要求[J].交通部上海船舶运输科学研究所学报,1999,22(1):49-53.
作者姓名:蒋时雨
摘    要:表面贴装技术是第四代电子装联技术。要保证表面贴装技术中的焊接质量,必须重视印刷电路板的设计。根据我所引进的表面贴装技术设备的生产现状,对表面贴装技术中的印刷电路板的设计提出一些要求。概略介绍对印刷电路板的基准标准点设置、定位孔与组合板设计、贴片元器件布置以及布线与焊盘设计的要求。

关 键 词:电子装联技术  表面贴装  印刷电路板设计

Requirements for Printed Circult Board Design in Surface Mounting Technology
Authors:Jian  Shiyu
Institution:Engineering Center
Abstract:Surface mounting technology (SMT) is the fourth generation of electronics assembly technique. To ensure the welding quality in surface mounting technology more attentions must be paid to the design of printed circult board. According to the present condition of the imported surface mounting technical equipments by SSSRI some requirements for the design of printed circult board in SMT are put forward by the paper. The requirements for the setting of the basic reference mark of printed circult board, the design of location holes and combination boards, the arrangements of elementary surface mounting devices, the design of wiring and welding tray are briefly introduced in the paper.
Keywords:Electronics assembly technique  surface mounting  design of printed circult board  
本文献已被 CNKI 维普 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号