| PARYLENE真空涂覆后模块BGA芯片的返修工艺研究 |
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| 引用本文： | 简卫东,谢陈难. PARYLENE真空涂覆后模块BGA芯片的返修工艺研究[J]. 舰船电子工程, 2012, 32(4): 140-141 |
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| 作者姓名： | 简卫东 谢陈难 |
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| 作者单位： | 武汉数字工程研究所,武汉,430074 |
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| 摘 要： | Parylene真空涂覆是一种近年来国内用于材料表面防护的新工艺,由于其优异的表面防护效果正逐渐为越来越多的用户认可。但经过真空涂覆的电子电路模块由于表面有一层极薄的聚对二甲苯膜层,造成了其上的球栅阵列（BGA）等类型芯片的返工困难。为了解决这个问题,通过试验及数据分析,形成了独特的返修工艺。
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| 关 键 词： | 真空涂覆 聚对二甲苯 球栅阵列 返修 |
Rework Method of BGA Devices on the Assemblys with Vacuum Coating |
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| JIAN Weidong,XIE Chennan. Rework Method of BGA Devices on the Assemblys with Vacuum Coating[J]. Ship Electronic Engineering, 2012, 32(4): 140-141 |
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| Authors: | JIAN Weidong XIE Chennan |
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| Affiliation: | (Wuhan Digital Engineering Institute,Wuhan 430074) |
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| Abstract: | Vacuum coating is a new material protection technology.After vacuum coating,the assemblys’ surface was all covered by parylene film.It was difficulty to rework the BGA devices on the assemblys.Many tests were done in order to resolve this problem.Finally,a special rework method was summarized and used in the producting. |
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| Keywords: | vacuum coating parylene ball grid array(BGA) rework |
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