电镀工艺中几个基本理论问题的研究

本文以络合物和电化学的基本理论为依据,利用络合物生成(平衡)常数(K)、稳定常数(Ks)和难溶电解质的溶度积常数(Ksp)间的关系,推导出了电镀溶液中金属离子和络合剂理论浓度间关系的计算公式;较详细地阐述了络离子的形成对阴极电极反应、标准电极电位、过电位和电镀时金属析出电位的重要影响,从而为合金电镀提供了重要的理论依据.

Research on Several Basic Theoretic Problems in Electroplating Technology

On the basis of the basic theories of complexing compound and e-lectrochemistry .the relationship between the equilibrium constant (K). stability cons-tant(Ks) of comptexing compound and solubilty product constant(Ksp) of slghtly soluble electrolyte is appfed to derive the equations between the metal ion and comptexing ing agent theoretic concentrations in electroplating solutions in this paper. The influence of the formation of complexing ions in electroplating on the cathodic electrode reaction. standard electrode potential, overpotential and metal evduted potential is also expounded in this paper. Therefore providing the importent theoretic basic for alloy electroplating.