| 可剥蓝胶的制作及应用 |
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| 引用本文： | 刘健,肖勇.可剥蓝胶的制作及应用[J].舰船电子工程,2006,26(3):181-182. |
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| 作者姓名： | 刘健 肖勇 |
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| 作者单位： | 武汉数字工程研究所,武汉,430074 |
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| 摘 要： | 介绍了一种用于热风整平、回流焊、波峰焊以及金手指和印制板部分的保护层——可剥蓝胶，并详细介绍了其制作工艺过程。另外，还与高温胶带在使用和成本上作了一个比较。
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| 关 键 词： | 可剥蓝胶 剥离 热固化 高温胶带 |
| 收稿时间： | 2005-12-17 |
| 修稿时间： | 2006-02-24 |
Fabrication and Application of Peelable Solder Mask Ink |
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| Liu Jian,Xiao Yong.Fabrication and Application of Peelable Solder Mask Ink[J].Ship Electronic Engineering,2006,26(3):181-182. |
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| Authors: | Liu Jian Xiao Yong |
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| Institution: | Wuhan Digital Engineering Institute,Wuhan 430074 |
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| Abstract: | One protection layer which used in HASL, wave soldering, golden fingers, reflow soldering and part of PCB is introduced by this article. It also particular introduces its fabrication process. Except that, it compact the use and cost with high termperature adhesives. |
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| Keywords: | peelable solder mask ink peel off heat cured high termperture adhesives |
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