| 铜-氮化硅复合电沉积过程的交流阻抗测试分析 |
| |
| 引用本文： | 杜克勤,邹恩义,王炜.铜-氮化硅复合电沉积过程的交流阻抗测试分析[J].大连铁道学院学报,1998(1). |
| |
| 作者姓名： | 杜克勤 邹恩义 王炜 |
| |
| 作者单位： | 大连铁道学院应用化学系 |
| |
| 摘 要： | 通过交流阻抗测试法研究了Ｃｕ－Ｓｉ３Ｎ４复合电沉积过程Ｓｉ３Ｎ４微粒对阴极电化学行为的影响，结果表明：Ｓｉ３Ｎ４粒子在电极表面存在吸附，阴极极化增加，吸附增强；吸附粒子阻碍金属离子阴极放电沉积。
|
| 关 键 词： | 交流阻抗 复合电沉积 吸附 |
Electrochemical Impedance Spectroscopy Study of Si 3N 4 Particle Occlusion during Copper Electrodeposition |
| |
| Du Keqin,Zhou Enyi,Wang Wei.Electrochemical Impedance Spectroscopy Study of Si 3N 4 Particle Occlusion during Copper Electrodeposition[J].Journal of Dalian Railway Institute,1998(1). |
| |
| Authors: | Du Keqin Zhou Enyi Wang Wei |
| |
| Institution: | Dept. of Applied Chemistry |
| |
| Abstract: | Analyses the effect of Si 3N 4 particles on the mechanism of copper Si 3N 4 coelectrodeposition during electrochemical impedance spectroscopy experiments.The main conclusinos are: (1) the particles adsorp at cathod surface and a rise in cathodic polarization enhances the adsorption effect;(2) the particle adsorption at electrode surface impedes the meta lion reduction,enhances the cathodic polarization. |
| |
| Keywords: | electrochemical impedance spectroscopy co-electrodeposition adsorption |
| 本文献已被 CNKI 等数据库收录！ |
