INTERLAYER MATERIALS DESIGN OF HPSN/K-500 JOINT

Composite interlayer materials containing active elements was designed, with the aid of EDAX, XRD analysis technology and thermal elastic-plastic finite element analysis in 3-demensions. When a suitable composite interlayer material was adopted in the diffusion bonding of HPSN to K-500, the bending strength of the joints would be up to 216 MPa and 218 MPa at room temperature and 800℃ respectively.